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STANDARD | ADVANCED |
Minimum Outer Line
Width/Space |
4/4 mils | Double Layers PCB 1oz/0.5oz：4/4 mils
Single Layer PCB 0.33oz ：3/3 mils |
Minimum Inner Line
Width/Space |
4/4 mils | 0.5oz：2/2 mils(工作片不補償) |
Minimum Outer Space,
Trace To Pad |
5 mils | 4 mils |
Minimum inner Space,
Trace To Pad |
4 mils | 3 mils |
| Minimum inner Clearance |
8 mils | 5 mils |
| Minimum Space ,PCB Edge to Conductor |
10 mils by routing | 8 mils |
| Layer-to-Layer Registration |
5 mils | 5 mils |
| Maximum Finished PCB Thickness |
3.2 mm | 3.2 mm |
| Minimum Board Thickness Tolerance |
10% | 6% |
Warpage (inch per inch)
(flatness of finished board) |
1% | 0.75% |
| Minimum Finished PCB Thickness |
0.6 mm | 0.4 mm |
| Minimum Component Pitch |
22 mils | 20 mils |
Minimum Dielectric
Thickness |
2.8 mils | 2 mils |
| Maximum Number of Layers |
10 | 12 |
| Minimum Plated Hole Size |
8 mils | 6 mils |
| Tolerance-Plated Hole Size |
±3 mils | ±3 mils |
| Min Finished Hole Size |
8 mils | 6 mils
4 mils (Laser) |
| Minimum Outer Layer Pad (1 mil annular ring) |
14 mils | 14 mils |
| Maximum Drill Hole Size |
250 mils | 250 mils |
Min Outer Non-Plated Hole to
Trace Spacing |
8 mils | 6 mils |
| Min Inner Non-Plated Hole Spacing |
8 mils | 6 mils |
Max Number holes/sq. in.
(average over board) |
300 | 300 |
| Minimum Drill Size |
0.2 mm | 0.15 mm
0.10 mm (Laser) |
| Maximum Aspect Ratio |
1:6 | 1:8 |
Testing Capabilities:
Type of Test Equipment |
Dedicated | Dedicated & Flying probe |
Solder-mask Criteria:
Solder-mask Criteria: |
7 mils with dam | 6 mils |
| Line to SMT Minimum Space |
4 mils | 3 mils |
| Minimum Solder mask Rib |
4 mils
5 mils(Black L/Q) | 3 mils
5 mils(Black L/Q) |
Material Available:
FR-4:Standard Multifunctional |
Tg (degrees C)
140 | Dielectric (TD)
310 |
FR-4:Improved Grade Multifunctional
(Tetra functional) 170Tg |
170 | 340 |
HASL Minimum Thickness
(Hot Air Solder Leveling) |
60 μ” | 60 μ” |
| HASL Maximum Thickness |
1000 μ” | 1000 μ” |
| Immersion Gold Minimum Thickness |
1 μ” | 1 μ” |
| Immersion Gold Maximum Thickness |
5 μ” | 5 μ” |
Entek (O.S.P) Organic
Solder-ability
Preservatives |
8-16 μ” | 8-16 μ” |
| White Tin |
25~30 μ” | 25~30 μ” |
| Immersion Silver |
8~12 μ” | 8~12 μ” |
| Flash Gold |
1~10 μ” | 1~10 μ” |
| Lead free HASL |
60~1000 μ” | 60~1000 μ”/td>
| Golden Finger |
1~30 μ” | 1~30 μ” |
| Impedance Tolerance |
±10% | ±10% |
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