HSU TZU ELECTRONIC CO LTD.
Home
中文
About US
Introduction
Evolution
Organization
Product
HDI
Multilayer PCB
Double Layers PCB
Single Layer PCB
Manufacture
Capability
Equipment
Production of process
Quality Policy
News
New Equipment
Employee Benefits
Careers
Contact Us
Equipment
Manufacture
Equipment
Production of process
1.Inner layer
Micro etching
Dry film lamination
Exposure
Developing + etching +film striping
Automatic Optical Inspection (A.O.I)(8K)
Inspection station
2.Lamination
Black oxide
Booking
Hot vacuum lamination
Target hole drilling MMX-888
X-Ray thickness measure machine
3.Drilling
Drilling machine
Drilling machine
Drilling A.O.I
Hole check machine 1200
4.P.T.H
Deburr machine
Scrubbing machine
Plating through hole(P.T.H)+panel plating
Pattern plating
Mircosection
Lab
5.Dry film
Micro etching or (scrubbing)
Dry film lamination
Exposure
Developing
6.Pattern Printing
Copper plating
Film stripping
Etching
Pattern width measurement
7.Liquid S/M
Scrubbing
Solder mask printing
Exposure
Develop
8.Surface treatment
8.1 HASL
Vertical hot air solder leveling
Horizontal hot air solder leveling
Hot Roll press process
Flux process
8.2 Immersion-Gold
Electro-less gold
Electrical gold plating
Electrical nickel plating
Post-treatment machine
8.3 OSP
OSP
OSP post-treatment
OSP loading
OSP unloading
8.4 Inspection Equipment
UV spectrum machine (U.V)
Automatical absorption machine (A.A)
X-Ray thickness detector
Metal analysis system
9.Screen legend
Pattern printing
Etching machine
Silk screen printing
UV curing
10.Final Shaping、V-cut
CNC router
V-groove cutting
PVD-550A
V-groove cutting
VMS-500
Punch
Groove thickness measure
3D dimension
11.O.Q.C
Flying probe testing machine
EMMA-E4L6151
Polar CIT9000S4
Polar test
High volt tester
O/S measure
12.Package & Shipping
Shrink film packing machine
PP Vacuum packing machine
WSV800L